The Global Semiconductor Molding Systems Market Report was published by QY Research recently.
Summary
According to our latest research, the global semiconductor molding system size is estimated to be USD 397.86 million in 2022 from USD 443.29 million in 2021, the global semiconductor molding system market size is expected to grow at a CAGR of 10.2% for the next six years.
In terms of region, the global semiconductor molding system market can be segregated into North America, Europe, Asia Pacific and Latin America. Asia Pacific is projected to lead the global market during the forecast period. It is estimated that from 2022 to 2028, the average annual compound growth rate of the Asia-pacific region will reach 11.7%.
The global major manufacturers of Semiconductor Molding Systems include TOWA, ASMPT, Besi, I-PEX, Yamada, TAKARA TOOL & DIE, Asahi Engineering, Tongling Fushi Sanjia, and Nextool Technology, etc.
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The report mentions the prominent market player consisting of:
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
Semiconductor Molding Systems Market Segment by Type
Fully Automatic
Semi-automatic
Manual
Semiconductor Molding Systems Market Segment by Application
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
The report on the Semiconductor Molding Systems market covers the following region (country) analysis:
Production by Region
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
India
Others
Europe
Germany
France
U.K.
Italy
Netherlands
Rest of Europe
South America
Mexico
Brazil
Rest of South America
Key Objectives of This Report
To study and analyze the global Semiconductor Molding Systems consumption (value & volume) by key regions/countries, type and application, history data from 2017 to 2022, and forecast to 2028.
To understand the structure of Semiconductor Molding Systems market by identifying its various subsegments.
Focuses on the key global Semiconductor Molding Systems manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Semiconductor Molding Systems with respect to individual growth trends, prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges, and risks).
To project the consumption of Semiconductor Molding Systems submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Table of Contents
1 SEMICONDUCTOR MOLDING SYSTEMS MARKET OVERVIEW 1
1.1 PRODUCT OVERVIEW AND SCOPE OF SEMICONDUCTOR MOLDING SYSTEMS 1
1.2 SEMICONDUCTOR MOLDING SYSTEMS SEGMENT BY TYPE 1
1.2.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS MARKET SIZE GROWTH RATE ANALYSIS BY TYPE: 2022 VS 2028 2
1.2.2 FULLY AUTOMATIC 2
1.2.3 SEMI-AUTOMATIC 3
1.2.4 MANUAL 3
1.3 SEMICONDUCTOR MOLDING SYSTEMS SEGMENT BY APPLICATION 4
1.3.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS MARKET SIZE GROWTH RATE ANALYSIS BY APPLICATION: 2022 VS 2028 4
1.3.2 WAFER LEVEL PACKAGING 5
1.3.3 BGA PACKAGING 5
1.3.4 FLAT PANEL PACKAGING 6
1.3.5 OTHERS 6
1.4 GLOBAL MARKET GROWTH PROSPECTS 8
1.4.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS REVENUE ESTIMATES AND FORECASTS (2017-2028) 8
1.4.2 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION ESTIMATES AND FORECASTS (2017-2028) 9
1.5 GLOBAL MARKET SIZE BY REGION 9
1.5.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS MARKET SIZE ESTIMATES AND FORECASTS BY REGION: 2017 VS 2022 VS 2028 10
1.5.2 NORTH AMERICA SEMICONDUCTOR MOLDING SYSTEMS ESTIMATES AND FORECASTS (2017-2028) 11
1.5.3 EUROPE SEMICONDUCTOR MOLDING SYSTEMS ESTIMATES AND FORECASTS (2017-2028) 11
1.5.4 ASIA-PACIFIC SEMICONDUCTOR MOLDING SYSTEMS ESTIMATES AND FORECASTS (2017-2028) 12
1.5.5 LATIN AMERICA SEMICONDUCTOR MOLDING SYSTEMS ESTIMATES AND FORECASTS (2017-2028) 13
2 MARKET COMPETITION BY MANUFACTURERS 14
2.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION BY MANUFACTURERS (2017-2022) 14
2.2 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS REVENUE MARKET SHARE BY MANUFACTURERS (2017-2022) 15
2.3 SEMICONDUCTOR MOLDING SYSTEMS MARKET SHARE BY COMPANY TYPE (TIER 1, TIER 2, AND TIER 3) 17
2.4 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS AVERAGE PRICE BY MANUFACTURERS (2017-2022) 18
2.5 MANUFACTURERS SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION SITES, PRODUCT TYPE 19
2.6 SEMICONDUCTOR MOLDING SYSTEMS MARKET COMPETITIVE SITUATION AND TRENDS 20
2.6.1 SEMICONDUCTOR MOLDING SYSTEMS MARKET CONCENTRATION RATE 20
2.6.2 GLOBAL 5 AND 10 LARGEST SEMICONDUCTOR MOLDING SYSTEMS PLAYERS MARKET SHARE BY REVENUE 21
2.6.3 MERGERS & ACQUISITIONS, EXPANSION 21
3 PRODUCTION BY REGION 22
3.1 GLOBAL PRODUCTION OF SEMICONDUCTOR MOLDING SYSTEMS BY REGION (2017-2022) 22
3.2 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS REVENUE MARKET SHARE BY REGION (2017-2022) 22
3.3 EUROPE SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION 23
3.3.1 EUROPE SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION GROWTH RATE (2017-2022) 23
3.4 CHINA SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION (2017-2022) 24
3.4.1 CHINA SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION GROWTH RATE (2017-2022) 24
3.5 JAPAN SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION (2017-2022) 24
3.5.1 JAPAN SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION GROWTH RATE (2017-2022) 24
4 SEMICONDUCTOR MOLDING SYSTEMS CONSUMPTION BY REGION 25
4.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS CONSUMPTION BY REGION 25
4.1.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS CONSUMPTION BY REGION 25
4.1.2 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS CONSUMPTION MARKET SHARE BY REGION 25
4.2 NORTH AMERICA 26
4.2.1 NORTH AMERICA SEMICONDUCTOR MOLDING SYSTEMS CONSUMPTION BY COUNTRY 27
4.2.2 U.S. 28
4.2.3 CANADA 28
4.3 EUROPE 29
4.3.1 EUROPE SEMICONDUCTOR MOLDING SYSTEMS CONSUMPTION BY COUNTRY 29
4.3.2 GERMANY 30
4.3.3 FRANCE 31
4.3.4 U.K. 31
4.3.5 ITALY 32
4.3.6 NETHERLANDS 32
4.4 ASIA PACIFIC 33
4.4.1 ASIA PACIFIC SEMICONDUCTOR MOLDING SYSTEMS CONSUMPTION BY REGION 33
4.4.2 CHINA 34
4.4.3 JAPAN 35
4.4.4 SOUTH KOREA 35
4.4.5 INDIA 36
4.5 LATIN AMERICA 36
4.5.1 LATIN AMERICA SEMICONDUCTOR MOLDING SYSTEMS CONSUMPTION BY COUNTRY 37
4.5.2 MEXICO 38
4.5.3 BRAZIL 38
5 SEGMENT BY TYPE 39
5.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION MARKET SHARE BY TYPE (2017-2022) 39
5.2 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS REVENUE MARKET SHARE BY TYPE (2017-2022) 40
5.3 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS PRICE BY TYPE (2017-2022) 41
6 SEGMENT BY APPLICATION 42
6.1 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION MARKET SHARE BY APPLICATION (2017-2022) 42
6.2 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS REVENUE MARKET SHARE BY APPLICATION (2017-2022) 43
6.3 GLOBAL SEMICONDUCTOR MOLDING SYSTEMS PRICE BY APPLICATION (2017-2022) 45
7 KEY COMPANIES PROFILED 46
7.1 TOWA 46
7.1.1 TOWA SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 46
7.1.2 TOWA SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 46
7.1.3 TOWA SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 49
7.1.4 TOWA MAIN BUSINESS AND MARKETS SERVED 49
7.1.5 TOWA RECENT DEVELOPMENTS/UPDATES 49
7.2 YAMADA 49
7.2.1 YAMADA SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 50
7.2.2 YAMADA SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 50
7.2.3 YAMADA SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 52
7.2.4 YAMADA MAIN BUSINESS AND MARKETS SERVED 52
7.2.5 YAMADA RECENT DEVELOPMENTS/UPDATES 52
7.3 BESI 53
7.3.1 BESI SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 53
7.3.2 BESI SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 53
7.3.3 BESI SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 56
7.3.4 BESI MAIN BUSINESS AND MARKETS SERVED 56
7.3.5 BESI RECENT DEVELOPMENTS/UPDATES 56
7.4 ASMPT 56
7.4.1 ASMPT SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 56
7.4.2 ASMPT SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 57
7.4.3 ASMPT SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 58
7.4.4 ASMPT MAIN BUSINESS AND MARKETS SERVED 58
7.4.5 ASMPT RECENT DEVELOPMENTS/UPDATES 59
7.5 I-PEX 59
7.5.1 I-PEX SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 59
7.5.2 I-PEX SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 60
7.5.3 I-PEX SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 62
7.5.4 I-PEX MAIN BUSINESS AND MARKETS SERVED 62
7.5.5 I-PEX RECENT DEVELOPMENTS/UPDATES 62
7.6 TAKARA TOOL & DIE 63
7.6.1 TAKARA TOOL & DIE SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 63
7.6.2 TAKARA TOOL & DIE SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 63
7.6.3 TAKARA TOOL & DIE SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 64
7.6.4 TAKARA TOOL & DIE MAIN BUSINESS AND MARKETS SERVED 64
7.7 ASAHI ENGINEERING 65
7.7.1 ASAHI ENGINEERING SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 65
7.7.2 ASAHI ENGINEERING SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 65
7.7.3 ASAHI ENGINEERING SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 68
7.7.4 ASAHI ENGINEERING MAIN BUSINESS AND MARKETS SERVED 68
7.8 TONGLING FUSHI SANJIA 68
7.8.1 TONGLING FUSHI SANJIA SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 68
7.8.2 TONGLING FUSHI SANJIA SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 69
7.8.3 TONGLING FUSHI SANJIA SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 69
7.8.4 TONGLING FUSHI SANJIA MAIN BUSINESS AND MARKETS SERVED 70
7.8.5 TONGLING FUSHI SANJIA RECENT DEVELOPMENTS/UPDATES 70
7.9 NEXTOOL TECHNOLOGY 70
7.9.1 NEXTOOL TECHNOLOGY SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 70
7.9.2 NEXTOOL TECHNOLOGY SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 71
7.9.3 NEXTOOL TECHNOLOGY SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 71
7.9.4 NEXTOOL TECHNOLOGY MAIN BUSINESS AND MARKETS SERVED 72
7.9.5 NEXTOOL TECHNOLOGY RECENT DEVELOPMENTS/UPDATES 72
7.10 DAHUA TECHNOLOGY 72
7.10.1 DAHUA TECHNOLOGY SEMICONDUCTOR MOLDING SYSTEMS CORPORATION INFORMATION 72
7.10.2 DAHUA TECHNOLOGY SEMICONDUCTOR MOLDING SYSTEMS PRODUCT PORTFOLIO 73
7.10.3 DAHUA TECHNOLOGY SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE, PRICE AND GROSS MARGIN (2017-2021) 74
7.10.4 DAHUA TECHNOLOGY MAIN BUSINESS AND MARKETS SERVED 74
8 SEMICONDUCTOR MOLDING SYSTEMS MANUFACTURING COST ANALYSIS 75
8.1 SEMICONDUCTOR MOLDING SYSTEMS KEY RAW MATERIALS ANALYSIS 75
8.1.1 SEMICONDUCTOR PLASTISOL INDUSTRY SUPPLY CHAIN ANALYSIS 75
8.1.2 KEY SUPPLIERS OF RAW MATERIALS 75
8.2 PROPORTION OF MANUFACTURING COST STRUCTURE 75
8.3 SEMICONDUCTOR MOLDING SYSTEMS INDUSTRIAL CHAIN ANALYSIS 76
9 MARKETING CHANNEL, DISTRIBUTORS AND CUSTOMERS 77
9.1 MARKETING CHANNEL 77
9.2 SEMICONDUCTOR MOLDING SYSTEMS DISTRIBUTORS LIST 78
9.3 SEMICONDUCTOR MOLDING SYSTEMS CUSTOMERS 79
10 SEMICONDUCTOR MOLDING SYSTEMS MARKET DYNAMICS 80
10.1 SEMICONDUCTOR MOLDING SYSTEMS INDUSTRY TRENDS 80
10.2 SEMICONDUCTOR MOLDING SYSTEMS MARKET DRIVERS 80
11 PRODUCTION AND SUPPLY FORECAST 81
11.1 GLOBAL FORECASTED PRODUCTION OF SEMICONDUCTOR MOLDING SYSTEMS BY REGION (2023-2028) 81
11.2 EUROPE SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE FORECAST (2023-2028) 82
11.3 CHINA SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE FORECAST (2023-2028) 82
11.4 JAPAN SEMICONDUCTOR MOLDING SYSTEMS PRODUCTION, REVENUE FORECAST (2023-2028) 83
12 CONSUMPTION AND DEMAND FORECAST 84
12.1 GLOBAL FORECASTED DEMAND ANALYSIS OF SEMICONDUCTOR MOLDING SYSTEMS 84
12.2 NORTH AMERICA FORECASTED CONSUMPTION OF SEMICONDUCTOR MOLDING SYSTEMS BY COUNTRY 84
12.3 EUROPE MARKET FORECASTED CONSUMPTION OF SEMICONDUCTOR MOLDING SYSTEMS BY COUNTRY 85
12.4 ASIA PACIFIC MARKET FORECASTED CONSUMPTION OF SEMICONDUCTOR MOLDING SYSTEMS BY REGION 85
12.5 LATIN AMERICA FORECASTED CONSUMPTION OF SEMICONDUCTOR MOLDING SYSTEMS BY COUNTRY 85
13 FORECAST BY TYPE AND BY APPLICATION 87
13.1 GLOBAL PRODUCTION, REVENUE AND PRICE FORECAST BY TYPE (2023-2028) 87
13.1.1 GLOBAL FORECASTED PRODUCTION OF SEMICONDUCTOR MOLDING SYSTEMS BY TYPE (2023-2028) 87
13.1.2 GLOBAL FORECASTED REVENUE OF SEMICONDUCTOR MOLDING SYSTEMS BY TYPE (2023-2028) 87
13.1.3 GLOBAL FORECASTED PRICE OF SEMICONDUCTOR MOLDING SYSTEMS BY TYPE (2023-2028) 88
13.2 GLOBAL PRODUCTION, REVENUE AND PRICE FORECAST BY APPLICATION (2023-2028) 88
13.2.1 GLOBAL FORECASTED PRODUCTION OF SEMICONDUCTOR MOLDING SYSTEMS BY APPLICATION (2023-2028) 88
13.2.2 GLOBAL FORECASTED REVENUE OF SEMICONDUCTOR MOLDING SYSTEMS BY APPLICATION (2023-2028) 89
13.2.3 GLOBAL FORECASTED PRICE OF SEMICONDUCTOR MOLDING SYSTEMS BY APPLICATION (2023-2028) 90
14 RESEARCH FINDINGS AND CONCLUSION 91
15 METHODOLOGY AND DATA SOURCE 92
15.1 METHODOLOGY/RESEARCH APPROACH 92
15.1.1 RESEARCH PROGRAMS/DESIGN 92
15.1.2 MARKET SIZE ESTIMATION 93
15.1.3 MARKET BREAKDOWN AND DATA TRIANGULATION 94
15.2 DATA SOURCE 95
15.2.1 SECONDARY SOURCES 95
15.2.2 PRIMARY SOURCES 96
15.3 AUTHOR LIST 97
15.4 DISCLAIMER 97
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