BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
LPI (LP Information)’ newest research report, the “Back Grinding Tapes (BGT) Industry Forecast” looks at past sales and reviews total world Back Grinding Tapes (BGT) sales in 2022, providing a comprehensive analysis by region and market sector of projected Back Grinding Tapes (BGT) sales for 2023 through 2029. With Back Grinding Tapes (BGT) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Back Grinding Tapes (BGT) industry.
This Insight Report provides a comprehensive analysis of the global Back Grinding Tapes (BGT) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Back Grinding Tapes (BGT) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Back Grinding Tapes (BGT) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Back Grinding Tapes (BGT) and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Back Grinding Tapes (BGT).
The global Back Grinding Tapes (BGT) market size is projected to grow from US$ 183.6 million in 2022 to US$ 259.7 million in 2029; it is expected to grow at a CAGR of 259.7 from 2023 to 2029.
The world’s top five back grinding tapes (BGT) manufacturers include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka., which together account for more than 85% of the market share, of which the largest producer is Mithui Chemicals Tohcello, accounting for more than 30% of the market. Japan is the world’s leading back-grinding tape production region, accounting for more than 40% of the market share. In terms of type, the market share of UV tape is more than 55%. In the application field, bump accounts for about 50% of the market share.
This report presents a comprehensive overview, market shares, and growth opportunities of Back Grinding Tapes (BGT) market by product type, application, key manufacturers and key regions and countries.
Top Manufactures in Global Back Grinding Tapes (BGT) Includes:
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Market Segment by Type, covers:
UV Type
Non-UV Type
Market Segment by Applications, can be divided into:
Standard
Standard Thin Die
(S)DBG (GAL)
Bump
Key Questions Addressed in this Report
What is the 10-year outlook for the global Back Grinding Tapes (BGT) market?
What factors are driving Back Grinding Tapes (BGT) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Back Grinding Tapes (BGT) market opportunities vary by end market size?
How does Back Grinding Tapes (BGT) break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?
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