DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate.
Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
According to the new market research report “Global DCB and AMB Substrates Market Report 2023-2029”, published by QYResearch, the global DCB and AMB Substrates market size is projected to reach USD 3.27 billion by 2029, at a CAGR of 20.2% during the forecast period.
- Global DCB and AMB Substrates MarketSize(US$ Million), 2018-2029
Above data is based on report from QYResearch: Global DCB and AMB Substrates Market Report 2023-2029 (published in 2023). If you need the latest data, plaese contact QYResearch..
- Global DCB and AMB Substrates Top24Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
Above data is based on report from QYResearch: Global DCB and AMB Substrates Market Report 2023-2029 (published in 2023). If you need the latest data, plaese contact QYResearch.
The global key manufacturers of DCB and AMB Substrates include Rogers Corporation, Ferrotec, Denka, KCC, BYD, Shengda Tech, Heraeus Electronics, Nanjing Zhongjiang New Material, Zibo Linzi Yinhe High-Tech, NGK Electronics Devices, etc. In 2022, the global top five players had a share approximately 78.0% in terms of revenue.
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