The low-pressure injection molding process is a packaging process that uses very low injection pressure to inject hot-melt adhesive material into the mold and quickly solidifies it (the speed only takes 1-50 seconds). It uses hot-melt adhesive as the material and has excellent sealing properties. And excellent physical properties, product performance achieves insulation, temperature resistance, impact resistance, shock absorption, moisture-proof, waterproof, dust-proof, chemical corrosion resistance and other functions.
This process is currently mainly used in the packaging and protection of precision and sensitive electronic components, including: printed circuit boards (PCBs), automotive electronics, mobile phone batteries, wiring harnesses, waterproof connectors, sensors, micro switches, inductors, and antennas etc.
Low-pressure injection molding plays a good role in protecting electronic components. The traditional injection molding process has defects due to excessive pressure. Because low-pressure molding requires only a small pressure to make the melt flow into a small mold space, it will not damage the fragile components that need to be packaged, greatly reducing the cost. The low-pressure injection molding process is not only environmentally friendly, but also greatly improves production efficiency and can help reduce the total production cost.
Low pressure injection molding hot melt adhesive. This material is able to reach small areas without high pressure, making it ideal for sensitive components. The adhesive properties of polyamide provide optimal bonding and effectively seal against moisture and other environmental contaminants. The high chemical resistance of low-pressure molding hot melt adhesives represented by polyamide to oil, diesel, grease and weak acids also improves the performance of the finished product.
According to the new market research report “Global hot melt adhesive Market Report 2023-2029”, published by QYResearch, the global hot melt adhesive market size is projected to reach USD 0.37 billion by 2029, at a CAGR of 7.0% during the forecast period.
- Global hot melt adhesive MarketSize(US$ Million), 2018-2029
Above data is based on report from QYResearch: Global hot melt adhesive Market Report 2023-2029 (published in 2023). If you need the latest data, plaese contact QYResearch..
- Global hot melt adhesive Top5Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
Above data is based on report from QYResearch: Global hot melt adhesive Market Report 2023-2029 (published in 2023). If you need the latest data, plaese contact QYResearch.
The global key manufacturers of hot melt adhesive include Henkel, Bostik, Huntsman, SUNTIP, Austromelt, Bühnen, KY Chemical, etc. In 2021, the global top five players had a share approximately 81.0% in terms of revenue.
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