According to the new market research report “Silver Powder and Paste for Electronic Components – Global Market Insights and Sales Trends 2024”, published by QYResearch, the global Silver Powder and Paste for Electronic Components market size is projected to reach USD 0.68 billion by 2029, at a CAGR of 2.1% during the forecast period.
- Global Silver Powder and Paste for Electronic Components MarketSize(US$ Million), 2018-2029
Source: QYResearch, “Silver Powder and Paste for Electronic Components – Global Market Insights and Sales Trends 2024”
- Global Silver Powder and Paste for Electronic Components Top15Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
Source: QYResearch, “Silver Powder and Paste for Electronic Components – Global Market Insights and Sales Trends 2024”
The global key manufacturers of Silver Powder and Paste for Electronic Components include Shoei Chemical, Heraeus, CNMC, Mitsui Kinzoku, ZHEJIANG CHANGGUI METAL POWDER CO.LTD, Kunming Noble Metal Electronic Materials CO.LED, Fukuda, TongLing Nonferrous Metals Group Holdings Co.,Ltd, NINGBO JINGXIN ELECTRONIC MATERIAL CO., LTD., Ames Goldsmith, etc.
In 2022, the global top five players had a share approximately 59.0% in terms of revenue.
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