The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and testing. Packaging refers to cutting, wire bonding, molding, trim & forming the wafer after production and processing, so that the integrated circuit can achieve electrical and signal connections with external devices while providing physical and chemical protection for the integrated circuit.
Molding refers to a plastic molding process in which packaging materials such as epoxy resin mixture are injected into the mold cavity at a certain temperature and pressure, and the devices that need to be protected, such as chips, are wrapped in the plastic, and then solidified into a whole body.
The roles of Molding products in semiconductor packaging are as follows:
- Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging.
- Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged.
- Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it.
- Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.
According to the new market research report "Semiconductor Molding System - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030", published by QYResearch, the global Semiconductor Molding System market size is projected to grow from USD 398 million in 2023 to USD 613 million by 2030, at a CAGR of 5.97% during the forecast period.
- Global Semiconductor Molding System MarketSize(US$ Million), 2019-2030
Source: QYResearch, "Semiconductor Molding System - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
- Global Semiconductor Molding System Top10Players Ranking and Market Share (Ranking is based on the revenue of 2023, continually updated)
Source: QYResearch, "Semiconductor Molding System - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
According to QYResearch Top Players Research Center, the global key manufacturers of Semiconductor Molding System include Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, etc. In 2023, the global top four players had a share approximately 85.0% in terms of revenue.
- Semiconductor Molding System,Global Market Size, Split by Product Segment
Source: QYResearch, "Semiconductor Molding System - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
In terms of product type, currently Fully Automatic is the largest segment, hold a share of 67.5%.
- Semiconductor Molding System,Global Market Size, Split by ApplicationSegment
Source: QYResearch, "Semiconductor Molding System - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
In terms of product application, currently Advanced Packaging is the largest segment, hold a share of 50.3% in 2023.
Market Drivers:
- The support and promotion of national policies are the core driving force for the development of semiconductor packaging equipment. For example, "Made in China 2025" proposes that intelligent manufacturing will enhance the overall competitiveness of China's manufacturing industry and is the core content of Industry 4.0. Among them, big data and cloud computing are key national development areas.
- The growing demand in the semiconductor industry is the prerequisite for the rapid growth of the semiconductor packaging equipment market: Stimulated by the demand for emerging application terminals such as the Internet of Things, cloud computing, big data, and new energy vehicles, the global semiconductor market has resumed its growth trend. As the world's largest semiconductor consumer market, China's demand for semiconductors continues to be strong, driving the growth in demand for semiconductor packaging equipment business.
- Advanced packaging technologies: such as Fan-out, SiP, 3D, WLP, flip-chip, chip stacking layer packaging, etc., promote the upgrading of equipment to meet the needs of smaller, more efficient, and higher performance.
- Downstream market demand: Increased demand for smartphones, automobiles, Internet of Things, data centers, artificial intelligence, 5G, cloud computing, edge computing, and smart devices will drive semiconductor usage and packaging equipment demand.
Restraint:
- 1. Lack of high-end technical talents:
The semiconductor equipment industry is a technology-intensive industry and has a high demand for professional and technical talents in the industry, including specific requirements such as professional theoretical knowledge, technology research and development capabilities, and practical operating experience. The lack of high-end technical talents has restricted the rapid development of the industry to a certain extent.
- 2. Cost pressure: The investment in semiconductor equipment is large, especially the high cost of advanced packaging equipment, which places a heavy burden on small and medium-sized enterprises and affects market popularity and return on investment in technological innovation.
Trend:
- Continuous growth: With the rapid development and expansion of the market in IoT, automotive electronics, artificial intelligence and other fields, the global packaging and testing industry continues to grow, and so will the semiconductor plastic sealing machine as packaging equipment.
- Further development of advanced packaging equipment: The bottleneck stage of Moore's Law has been reached, and the industry cannot continue to be driven by reducing the transistor size alone, which requires more advanced packaging technologies to reduce the package size and thus further save the space behind the IC package. Currently, advanced packaging mainly refers to DFN, QFN, Flip-Chip, WLCSP, and SiP. At present, although traditional packaging still occupies the majority of the packaging market, advanced packaging is gradually increasing its market application proportion with its unique advantages. The market share of semiconductor molding systems used for advanced packaging will also increase year by year, and market demand for equipment will promote the further development of advanced packaging equipment.
- More intelligent: The current mainstream semiconductor automatic packaging equipment in the market already has a strong level of automation and certain intelligent functions. In the future, as technology continues to develop and labor costs increase, semiconductor packaging equipment will become more intelligent, and its capabilities of self-perception, self-maintenance and automatic adaptation will be further improved to adapt to production needs.
About The Authors
Jiashi Dong
Lead Author Email: dongjiashi@qyresearch.com QYResearch Nanning Branch Analyst, as a member of the QYResearch Semiconductor Equipment and Materials Department, his main research areas include automotive electronics, semiconductor equipment, materials and thermally conductive powders. Some subdivided research topics include automotive diodes, automotive inductors, automotive lidar, radio frequency power supplies, plastic sealing machines, high-purity non-ferrous metals, battery materials, precursors, electroplating equipment, thermal conductive ball aluminum, semiconductor chemical plating solutions, semiconductor coating devices, etc. At the same time, he is also engaged in the development of market segment reports and participates in the writing of customized projects. |
About QYResearch
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