PVD and ALD coatings for chamber components are typically based on yttrium or aluminum oxides or may be made from aluminum oxynitride (AlON). The exact chemistry and coating thickness must be tailored to the application. The use of temperature in the chamber, processing time, and gases vary considerably depending on the device specifications, and these variables are used to select the right combination of coatings for their desired coating performance. Custom precision-engineered coatings provide the optimal balance between cost and performance.
Deposition chambers contain various parts and components that either contact the device wafer directly or are exposed to process chemicals that subsequently reach the wafer. As such, material selection is critical.
The corrosive chemicals used in plasma-etch chambers attack the tool component surfaces and degrade coatings. Longer exposure to hotter plasmas, which is common for 3D device processing, accelerates degradation. Particles shed from the corroded surfaces then deposit on the wafers, potentially causing device failure.
Components protected with yttrium oxide deposited by plasma spray-coating or made from anodized aluminum have long been the industry norm. Although such solutions have worked for many years, the nano-scale features of advanced process nodes demand an increased level of cleanliness for every part in the system. Conventionally coated components are not rugged enough to withstand the aggressive environments inside etch and deposition chambers without impacting device yield. Plasma spray coatings are relatively rough and porous, while anodized coatings exhibit in-situ cracking that makes them degrade too readily. The complex shapes of parts inside deposition chambers also pose a challenge for spray coating, which works best when coating planar surfaces.
Precision engineered, specialized coatings borrow vacuum thin film technologies associated with semiconductor wafer processing to produce coated components that can better resist the corrosion and oxidation that degrade conventional coatings. Two options are available: physical vapor deposition (PVD) and atomic layer deposition (ALD).
Every precision engineered coating must exhibit a minimum level of wear and corrosion resistance in the presence of corrosive plasma/chemistry and adhere fully to the underlying substrate to create a uniformly coated surface. The geometry and material of the part being coated, the type of chamber, and the processing conditions further dictate the optimal coating chemistry and method.
According to the new market research report “PVD and ALD Coating for Chamber Components- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-20300”, published by QYResearch, the global PVD and ALD Coating for Chamber Components market size is projected to reach USD 0.09 billion by 2030, at a CAGR of 7.4% during the forecast period.
- Global PVD and ALD Coating for Chamber Components MarketSize(US$ Million), 2019-2030
Source: QYResearch, "PVD and ALD Coating for Chamber Components- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
- Global PVD and ALD Coating for Chamber Components Top8Players Ranking and Market Share (Ranking is based on the revenue of 2023, continually updated)
Source: QYResearch, "PVD and ALD Coating for Chamber Components- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
According to QYResearch Top Players Research Center, the global key manufacturers of PVD and ALD Coating for Chamber Components include Entegris, KoMiCo, Inficon, Cinos, TOCALO Co., Ltd., etc. In 2023, the global top five players had a share approximately 75.0% in terms of revenue.
About The Authors
| Junping Yang - Lead Author | |
| Email: yangjunping@qyresearch.com | |
| Junping Yang is a technology & market senior analyst specializing in semiconductor devices, materials, and equipment. Yang has 10 years’ experience in semiconductor and focuses semiconductor equipment/parts, materials (silicon wafer, photoresist, CMP, silicon electrodes and rings), ICs, discrete devices, sensors/MEMS, RF, package & testing, etc. Typical studies include ICs, power semiconductor (IGBT, SiC, diode, MOSFET, modules and discrete), compound semiconductor (SiC, GaN, etc.), RF, optoelectronics, ceramic substrates (HTCC, LTCC, DBC, AMB, DPC, DBA), equipment & parts (wafer transfer robot, EFEM/Sorter, heaters, chiller, etc.), Lithography Systems, semiconductor refurbished/used equipment and parts, semiconductor chamber cleaning/coating, semiconductor equipment parts (ceramics, metal, plastic), Lasers, Electronic Ceramics, etc. He is engaged in the development of technology and market reports and is also involved in custom projects. |
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