Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
The global market for Semiconductor Assembly & Packaging Equipment was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Global Leading Market Research Publisher QYResearch announces the release of its latest report “Semiconductor Assembly & Packaging Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”. Based on current situation and impact historical analysis (2019-2023) and forecast calculations (2024-2030), this report provides a comprehensive analysis of the global Semiconductor Assembly & Packaging Equipment market, including market size, share, demand, industry development status, and forecasts for the next few years.
The report provides advanced statistics and information on global market conditions and studies the strategic patterns adopted by renowned players across the globe. As the market is constantly changing, the report explores competition, supply and demand trends, as well as the key factors that contribute to its changing demands across many markets.
This information will help stakeholders make informed decisions and develop effective strategies for growth. The report's analysis of the restraints in the market is crucial for strategic planning as it helps stakeholders understand the challenges that could hinder growth. This information will enable stakeholders to devise effective strategies to overcome these challenges and capitalize on the opportunities presented by the growing market. Furthermore, the report incorporates the opinions of market experts to provide valuable insights into the market's dynamics. This information will help stakeholders gain a better understanding of the market and make informed decisions.
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Global Semiconductor Assembly & Packaging Equipment Market: Driven factors and Restrictions factors
The research report encompasses a comprehensive analysis of the factors that affect the growth of the market. It includes an evaluation of trends, restraints, and drivers that influence the market positively or negatively. The report also outlines the potential impact of different segments and applications on the market in the future. The information presented is based on historical milestones and current trends, providing a detailed analysis of the production volume for each type from 2019 to 2030, as well as the production volume by region during the same period.
The report provides a detailed analysis of the market size, growth potential, and key trends for each segment. Through detailed analysis, industry players can identify profit opportunities, develop strategies for specific customer segments, and allocate resources effectively.
The Semiconductor Assembly & Packaging Equipment market is segmented as below:
By Company
ASM Pacific Technology
Kulicke & Soffa Industries
Besi
Accrutech
Shinkawa
Palomar Technologies
Hesse Mechatronics
Toray Engineering
West Bond
HYBOND
DIAS Automation
Segment by Type
Die Bonders
Wire Bonders
Packaging Equipment
Others
Segment by Application
IDMs
OSAT
Each chapter of the report provides detailed information for readers to further understand the Semiconductor Assembly & Packaging Equipment market:
Chapter 1: Semiconductor Assembly & Packaging Equipment Market Product Definition, Product Types, Sales Volume and Revenue analysis of Each Type in North America, Europe, Asia-Pacific, Latin America, Middle East and Africa from 2019 to 2024.
Chapter 2: Manufacturer Competition Status, including Sales and Revenue comparison, Manufacturers’ commercial date of Household Hazardous Waste Disposal, product type offered by each manufacturer, Mergers & Acquisitions activities, Expansion activities occurred in the Semiconductor Assembly & Packaging Equipment industry.
Chapter 3: Semiconductor Assembly & Packaging Equipment Market Historical (2019-2023) and forecast (2024-2030) sales and revenue analysis of Semiconductor Assembly & Packaging Equipment in North America, Europe, Asia-Pacific, Latin America, Middle East and Africa.
Chapter 4: Semiconductor Assembly & Packaging Equipment Product Application, Volume and Revenue analysis of Each Application in North America, Europe, Asia-Pacific, Latin America, Middle East and Africa from 2019 to 2024.
Chapter 5 to 9: Semiconductor Assembly & Packaging Equipment Country Level analysis of North America, Europe, Asia-Pacific, Latin America, Middle East and Africa, including volume and revenue analysis.
Chapter 10: Manufacturers’ Outline, covering company’s basic information like headquarter, contact information, major business, Semiconductor Assembly & Packaging Equipment introduction, etc. Semiconductor Assembly & Packaging Equipment Sales, Revenue, Price and Gross Margin of each company as well as Recent Development are also contained in this part.
Chapter 11: Industry Chain, including raw materials, manufacturing cost, are covered. In addition, market opportunities and challenges are emphasized as well in the chapter.
Chapter 12: Market Channel, Distributors and Customers are listed.
Chapter 13: QYResearch’s Conclusions of Semiconductor Assembly & Packaging Equipment market based on comprehensive survey.
Chapter 14: Methodology and Data Sources.
Table of Contents
1 Semiconductor Assembly & Packaging Equipment Market Overview
1.1Semiconductor Assembly & Packaging Equipment Product Overview
1.2 Semiconductor Assembly & Packaging Equipment Market by Type
1.3 Global Semiconductor Assembly & Packaging Equipment Market Size by Type
1.3.1 Global Semiconductor Assembly & Packaging Equipment Market Size Overview by Type (2019-2030)
1.3.2 Global Semiconductor Assembly & Packaging Equipment Historic Market Size Review by Type (2019-2024)
1.3.3 Global Semiconductor Assembly & Packaging Equipment Forecasted Market Size by Type (2025-2030)
1.4 Key Regions Market Size by Type
1.4.1 North America Semiconductor Assembly & Packaging Equipment Sales Breakdown by Type (2019-2024)
1.4.2 Europe Semiconductor Assembly & Packaging Equipment Sales Breakdown by Type (2019-2024)
1.4.3 Asia-Pacific Semiconductor Assembly & Packaging Equipment Sales Breakdown by Type (2019-2024)
1.4.4 Latin America Semiconductor Assembly & Packaging Equipment Sales Breakdown by Type (2019-2024)
1.4.5 Middle East and Africa Semiconductor Assembly & Packaging Equipment Sales Breakdown by Type (2019-2024)
2 Semiconductor Assembly & Packaging Equipment Market Competition by Company
2.1 Global Top Players by Semiconductor Assembly & Packaging Equipment Sales (2019-2024)
2.2 Global Top Players by Semiconductor Assembly & Packaging Equipment Revenue (2019-2024)
2.3 Global Top Players by Semiconductor Assembly & Packaging Equipment Price (2019-2024)
2.4 Global Top Manufacturers Semiconductor Assembly & Packaging Equipment Manufacturing Base Distribution, Sales Area, Product Type
2.5 Semiconductor Assembly & Packaging Equipment Market Competitive Situation and Trends
2.5.1 Semiconductor Assembly & Packaging Equipment Market Concentration Rate (2019-2024)
2.5.2 Global 5 and 10 Largest Manufacturers by Semiconductor Assembly & Packaging Equipment Sales and Revenue in 2023
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Assembly & Packaging Equipment as of 2023)
2.7 Date of Key Manufacturers Enter into Semiconductor Assembly & Packaging Equipment Market
2.8 Key Manufacturers Semiconductor Assembly & Packaging Equipment Product Offered
2.9 Mergers & Acquisitions, Expansion
...
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