In optical devices, optical chips are used for the conversion of photoelectric signals. According to the type of light emission, it is divided into surface emission and side emission. Among them, surface-emitting lasers are mainly VCSEL (vertical cavity surface-emitting lasers); there are many types of edge-emitting lasers, including FP (Fabry–Pérot, Fabry-Perot laser), DFB (Distributed Feedback Laser, distributed feedback laser) Lasers) and EML (Electroabsorption Modulated Laser), traditional FP laser chips have gradually narrowed their applications in the field of optical communication due to large losses and short transmission distances. There are three main types of core laser chips: DFB and EML And VCSEL.
This report only focus on the laser chip (major include DFB chip and EML chip and VCSEL chip) which are used in the Optical communication field. The report don’t include the market size of VCSEL chip used in the application of consumer electronics, Automotive, etc.
According to the new market research report “Optical Communication IC - Global Market Insights and Sales Trends 2024”, published by QYResearch, the global Optical Communication IC market size is projected to reach USD 7.06 billion by 2029, at a CAGR of 12.8% during the forecast period.
- Global Optical Communication IC MarketSize(US$ Million), 2018-2029
Source: QYResearch, "Optical Communication IC - Global Market Insights and Sales Trends 2024”
- Global Optical Communication IC Top12Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
Source: QYResearch, "Optical Communication IC - Global Market Insights and Sales Trends 2024”
The global key manufacturers of Optical Communication IC include II-VI Incorporated (Finisar), Lumentum (Oclaro), Broadcom, Sumitomo Electric, Accelink Technologies, Wuhan Elite Optronics, Hisilicon, Hisense Broadband, Mitsubishi Electric, Wuhan Mindsemi, etc. In 2022, the global top five players had a share approximately 60.0% in terms of revenue.
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