Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Solder paste is a suspension of solder particles in a solder flux, which is widely used in the electronic assembly materials.
According to the new market research report “Global Solder Paste Market Report 2023-2029”, published by QYResearch, the global Solder Paste market size is projected to reach USD 1.49 billion by 2029, at a CAGR of 2.9% during the forecast period.
- Global Solder Paste MarketSize(US$ Million), 2018-2029
Above data is based on report from QYResearch: Global Solder Paste Market Report 2023-2029 (published in 2023). If you need the latest data, plaese contact QYResearch..
- Global Solder Paste Top17Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
Above data is based on report from QYResearch: Global Solder Paste Market Report 2023-2029 (published in 2023). If you need the latest data, plaese contact QYResearch.
The global key manufacturers of Solder Paste include MacDermid Alpha Electronics Solutions, Senju Metal Industry, Harima Chemicals, Tongfang Tech, Heraeus, Shenzhen Vital New Material, AIM, Indium, Shengmao, Tamura, etc. In 2021, the global top five players had a share approximately 50.0% in terms of revenue.
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