The surface-mount IC packages that are assembled on a PCB are available in different types. The most popular ones among these are the QFN packages.
QFN is a leadframe based, plastic encapsulated chip scale package (CSP) that provides customers with an ideal choice for many applications where size, weight and thermal and electrical performance are important. A leadless package, QFN’s electrical connections are achieved by way of lands located on the bottom side of the component to the surface of the PCB. QFN packages have proven to be successful for a number of applications such as wireless handset, power management, analog baseband and Bluetooth devices.
According to the new market research report “Quad-Flat-No-Lead Packaging (QFN) - Global Market Insights and Sales Trends 2024”, published by QYResearch, the global Quad-Flat-No-Lead Packaging(Qfn) market size is projected to reach USD 3.19 billion by 2029, at a CAGR of 1.3% during the forecast period.
- Global Quad-Flat-No-Lead Packaging(Qfn) Market Size(US$ Million), 2018-2029
Source: QYResearch, "Quad-Flat-No-Lead Packaging (QFN) - Global Market Insights and Sales Trends 2024”
- Global Quad-Flat-No-Lead Packaging(Qfn) Top11Players Ranking and Market Share(Based on data of 2021, Continually updated)
Source: QYResearch, "Quad-Flat-No-Lead Packaging (QFN) - Global Market Insights and Sales Trends 2024”
The global key manufacturers of Quad-Flat-No-Lead Packaging(Qfn) include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc., Tongfu Microelectronics, Tianshui Huatian Technology, UTAC, Orient Semiconductor, ChipMOS, King Yuan Electronics, etc. In 2021, the global top five players had a share approximately 70.0% in terms of revenue.
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