Anti-Overflow Adhesive Special Film for FPC Market Summary
Anti-overflow adhesive special film is an important process material used in the production process of flexible circuit boards. Flexible circuit boards are mainly made by hot pressing and bonding materials such as metal conductor foil, thermosetting adhesive, and insulation substrate film. From the perspective of manufacturing technology, if the above materials are directly hot pressed, on the one hand, the thermosetting adhesive will overflow from the insulation substrate film and cover the surrounding metal conductor foil after being hot pressed, making it impossible to carry out subsequent surface gold plating or gold plating treatment on the metal conductor foil, as well as subsequent component welding; On the other hand, direct processing under high temperature and pressure can easily lead to the adhesion of the insulation substrate film to the pressing panel of the hot press, resulting in damage or wrinkling of the flexible circuit board. Therefore, during the hot-pressing process of flexible circuit boards, a layer of anti-overflow adhesive special film needs to be placed between the pressing panel and the flexible circuit board to play a role in anti-overflow, release, anti-wrinkle, protection, etc.
According to the new market research report “Global Anti-Overflow Adhesive Special Film for FPC Market Insights, Forecast to 2029”, published by QYResearch, the global Anti-Overflow Adhesive Special Film for FPC market size is projected to reach USD 0.32 billion by 2029, at a CAGR of 11.3% during the forecast period.
- Global Anti-Overflow Adhesive Special Film for FPC Market Size (US$ Million), 2018-2029
Source: QYResearch, “Global Anti-Overflow Adhesive Special Film for FPC Market Insights, Forecast to 2029”
Market Drivers:
- The growth of the flexible electronics market: With the increasing demand from consumers for lighter, thinner, flexible, and wearable devices, the flexible electronics market is showing a rapid growth trend. As the core component of flexible electronics, semiconductor flexible circuit boards will also have an increasing demand for anti-overflow special films.
- The development of 5G technology: With the popularization and application of 5G technology, the demand for high frequency, high-speed transmission, and low latency is also increasing. The anti-overflow adhesive special film has good electrical performance and high-frequency characteristics, which can meet the requirements of 5G equipment for high-frequency signal transmission. Therefore, it has broad application prospects in 5G equipment.
- Demand for emerging application fields: With the rapid development of emerging applications such as artificial intelligence, the Internet of Things, and smart homes, the demand for flexible electronic products is also increasing. As one of the key materials for flexible circuit boards, anti-overflow adhesive special films will play an important role in these emerging application fields.
- The development of flexible displays: Flexible displays are a lightweight, flexible display technology with broad application prospects. The anti-overflow adhesive special film can be used as the substrate material for flexible displays, providing good flexibility and flexibility, allowing the display to adapt to various curved surfaces and curved shapes.
- Global Anti-Overflow Adhesive Special Film for FPC Top 12 Players RankingandMarket Share（Continually updated）
Source: QYResearch, “Global Anti-Overflow Adhesive Special Film for FPC Market Insights, Forecast to 2029”
According to QYResearch Top Players Research Center, the global key manufacturers of Anti-Overflow Adhesive Special Film for FPC include Suzhou Xinguangyi Electronics, Mitsui Chemicals, Sekisui, Sumitomo Bakelite, Dupont, Ningbo Solartron Technology, FILKOR, Pacothane Technologies, Guangdong Dtech Technology, UNIPLUS ELECTRONICS, etc. In 2022, the global top five players had a share approximately 76.0% in terms of revenue.
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