This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
LPI (LP Information)' newest research report, the “Underfill Industry Forecast” looks at past sales and reviews total world Underfill sales in 2022, providing a comprehensive analysis by region and market sector of projected Underfill sales for 2023 through 2029. With Underfill sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfill industry.
This Insight Report provides a comprehensive analysis of the global Underfill landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfill portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Underfill market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfill and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfill.
The global Underfill market size is projected to grow from US$ 432.9 million in 2022 to US$ 559.5 million in 2029; it is expected to grow at a CAGR of 559.5 from 2023 to 2029.
North America is the largest market with about 38% market share. China is follower, accounting for about 20% market share.
The key players are Henkel, WON CHEMICAL, NAMICS, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond, DOVER, Darbond, HIGHTITE, U-bond etc. Top 3 companies occupied about 45% market share.
This report presents a comprehensive overview, market shares, and growth opportunities of Underfill market by product type, application, key manufacturers and key regions and countries.
Top Manufactures in Global Underfill Includes:
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond
Market Segment by Type, covers:
Semiconductor Underfills
Board Level Underfills
Market Segment by Applications, can be divided into:
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
Key Questions Addressed in this Report
What is the 10-year outlook for the global Underfill market?
What factors are driving Underfill market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Underfill market opportunities vary by end market size?
How does Underfill break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?
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