IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
LPI (LP Information)' newest research report, the “IC Packaging Industry Forecast” looks at past sales and reviews total world IC Packaging sales in 2022, providing a comprehensive analysis by region and market sector of projected IC Packaging sales for 2023 through 2029. With IC Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Packaging industry.
This Insight Report provides a comprehensive analysis of the global IC Packaging lands cape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global IC Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Packaging and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electronic Grade Phosphoric Acid.
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https://www.lpinformationdata.com/reports/454263/ic-packaging-2029
The global IC Packaging market size is projected to grow from US$ 37130 million in 2022 to US$ 48680 million in 2029; it is expected to grow at a CAGR of 48680 from 2023 to 2029.
Global IC Packaging key players include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, etc. Global top five manufacturers hold a share over 45%.
China Taiwan is the largest market, with a share over 40%, followed by China and South Korea, both have a share over 45%.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Packaging market by product type, application, key manufacturers and key regions and countries.
Top Manufactures in Global IC Packaging Includes:
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Unisem
NantongFujitsu Microelectronics
Hana Micron
Signetics
LINGSEN
Market Segment by Type, covers:
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Others
Market Segment by Applications, can be divided into:
CIS
MEMS
Others
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
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