Adhesivefree polyimide copper clad plate is a high-performance flexible circuit board material that eliminates the adhesive layer in traditional adhesive copper-clad laminates, resulting in superior electrical performance and thermal stability. This type of material is particularly suitable for high-frequency, high-power, and high-density wiring applications, such as satellite communication, radar systems, and high-end server motherboards.
According to the new market research report “Adhesivefree Polyimide Copper Clad Plate- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”, published by QYResearch, the global Adhesivefree Polyimide Copper Clad Plate market size is projected to reach USD 0.92 billion by 2030, at a CAGR of 5.3% during the forecast period.
- Global Adhesivefree Polyimide Copper Clad Plate Market Size (US$ Million), 2019-2030
Source: QYResearch, "Adhesivefree Polyimide Copper Clad Plate- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
- Global Adhesivefree Polyimide Copper Clad Plate Top 18Players Rankingand Market Share (Ranking is based on the revenue of 2023, continually updated)
Source: QYResearch, "Adhesivefree Polyimide Copper Clad Plate- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
According to QYResearch Top Players Research Center, the global key manufacturers of Adhesivefree Polyimide Copper Clad Plate include NIPPON STEEL Chemical & Material, Sytech, Sumitomo Metal Mining, Nitto Denko Corporation, Arisawa, Chang Chun Group (RCCT Technology), ITEQ Corporation, Doosan, UBE Corporation, Taiflex, etc. In 2023, the global top 10 players had a share approximately 69.0% in terms of revenue.
- Adhesivefree Polyimide Copper Clad Plate, Global Market Size, Split by Product Segment
Source: QYResearch, "Adhesivefree Polyimide Copper Clad Plate- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
In terms of product type, Double Sided is the largest segment, hold a share of 54.6%.
- Adhesivefree Polyimide Copper Clad Plate, Global Market Size, Split by Application Segment
Source: QYResearch, "Adhesivefree Polyimide Copper Clad Plate- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
In terms of product application, Consumer Electronics is the largest application, hold a share of 41.8%.
Market Drivers:
Adhesivefree two-layer flexible copper-clad laminates are mainly used for manufacturing flexible circuit boards (FPCs), which have a wide range of downstream applications and a large demand base. With the miniaturization of electronic devices and the increasing demand for flexible and wearable electronic products from consumers, the FPC market is expected to rebound in the coming years.
Continuous innovation and technological progress play a crucial role in expanding the market for adhesivefree two-layer flexible copper-clad laminates. New technologies typically improve products, increase efficiency, and enhance customer experience, thereby driving demand and market growth.
About The Authors
Yunmei Sun---Lead Author
Email: sunyunmei@qyresearch.com
Sun Yunmei has 2 years of industry research experience, focusing on research in the chemical industry chain related fields, including medical grade reagents, high-purity reagents for semiconductors, and chemical laboratory equipment.
About QYResearch
QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 17 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.
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