According to the new market research report “Epoxy Molding Compounds (EMC) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”, published by QYResearch, the global Epoxy Molding Compounds (EMC) market size is projected to reach USD 3.33 billion by 2030, at a CAGR of 4.4% during the forecast period.
- Global Epoxy Molding Compounds MarketSize(US$ Million), 2019-2030
Source: QYResearch, "Epoxy Molding Compounds (EMC) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
- Global Epoxy Molding Compounds Top10Players Ranking and Market Share (Ranking is based on the revenue of 2023, continually updated)
Source: QYResearch, "Epoxy Molding Compounds (EMC) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
According to QYResearch Top Players Research Center, the global key manufacturers of Epoxy Molding Compounds (EMC) include Sumitomo Bakelite, Showa Denko, Panasonic, Kyocera, Shin-Etsu Chemical, Chang Chun Group, Samsung SDI, KCC, Nagase ChemteX Corporation, Hysol Huawei Electronics, etc. In 2023, the global top 10 players had a share approximately 62.0% in terms of revenue.
- Epoxy Molding Compounds,Global Market Size, Split by Product Segment
Source: QYResearch, "Epoxy Molding Compounds (EMC) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
In terms of product type, currently Solid EMC is the largest segment, hold a share of 78.5%.
- Epoxy Molding Compounds,Global Market Size, Split by ApplicationSegment
Source: QYResearch, "Epoxy Molding Compounds (EMC) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
In terms of product application, currently Discrete is the largest segment, hold a share of 28.1%.
Market Drivers:
Many companies have developed new flame resisting technology for epoxy molding compounds used in semiconductors. The product incorporates a special "silicone flame resisting system" in place of the antimony compounds and brominated epoxy resins used in the past. In recent years, with consideration given to the environment, there is a trend in the semiconductor industry to use non-halogen materials (green compounds) that do not contain antimony or bromine. The system is an environment friendly technology that anticipates this trend. Demand for molding compounds that utilize the new system can be expected to increase in the future.
In recent years, the number of built-in semiconductors has increased as electronics have become increasingly used for auto- mobiles.1) Standards for reliability tests of built-in semiconductors, such as AEC-Q100, were established with stricter conditions rela- tive to the conditions for consumer use.2) To pass a strict reliability test, such as the b-HAST (the biased highly accelerated stress test), it is necessary to reduce the delamination of epoxy molding compounds on the surface of the lead frame in the reflow process.
In addition, to reduce costs, we need to eliminate moisture-proof packaging not only for built-in semiconductors but for semi- conductors for consumer use. Thus, we need to improve the moisture sensitivity level (MSL) against water absorption at reflow.
At the same time, the conventional gold wire has been replaced with copper wire to reduce costs, even though the latter cor- rodes more easily than the former. Regarding the use of copper wires, we already know that additives containing sulfur atoms used to improve adhesion with lead frames adversely affect the corrosion of the wire bonding zone.3) For this reason, additives that do not contain sulfur atoms are required.
With the professional and large-scale development of packaging enterprises, the production of EMC in the future will also be to scale, lead-free environmental protection, high-tech, low-cost development.
Restraint:
High risks involved with tight supply relationship and relatively closed industrial chain, it is difficult for new entrants to access the supply chain
The core technologies are mainly in the hands of the top manufacturers, who apply for patent protection for the technologies and key devices, and have a strong sense of confidentiality for the core parts of the production, so that new entrants have technical barriers
It will be stricter to the technical comprehensive strength, product development capabilities and full-service capabilities of manufacturers.
Opportunity:
Epoxy molding compounds (EMCs) are widely used in the electronics industry for encapsulating and protecting semiconductor devices. With the continuous advancement of electronic devices and the increasing demand for miniaturization, there has been a growing demand for EMCs.
There is a trend towards the use of high-performance epoxy molding compounds that offer better thermal conductivity, electrical insulation, and mechanical properties. Additionally, there is a growing emphasis on lightweight materials to meet the requirements of industries such as automotive and aerospace.
Environmental concerns and regulations have led to a greater focus on sustainable materials in various industries, including electronics. Manufacturers are exploring epoxy molding compounds with improved eco-friendly properties, such as low volatile organic compound (VOC) emissions and recyclability.
About The Authors
| Lu Jing - Lead Author |
| Email: lujing@qyresearch.com |
| Lu Jing is a technology & market senior analyst specializing in chemical, advanced material, and component. Lu has 9 years’ experience in chemical and focuses on catalyst and additive, metal and plastic materials, waste recycling, daily chemicals. She is engaged in the development of technology and market reports and is also involved in custom projects. |
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