Press-pack IGBTs are an alternative to isolated-base plastic modules. Instead of the wire bonds and solder joints used in isolated-base modules, press-packs rely on the application of force by an external clamping system, to make contact to the chips.
According to the new market research report “Press Pack IGBTs- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”, published by QYResearch, the global Press Pack IGBTs market size is projected to reach USD 0.21 billion by 2030, at a CAGR of 13.5% during the forecast period.
- Global Press Pack IGBTs MarketSize(US$ Million), 2019-2030
Source: QYResearch, "Press Pack IGBTs- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
- Global Press Pack IGBTs Top8Players Ranking and Market Share (Ranking is based on the revenue of 2023, continually updated)
Source: QYResearch, "Press Pack IGBTs- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
According to QYResearch Top Players Research Center, the global key manufacturers of Press Pack IGBTs include Littelfuse (IXYS), Zhuzhou CRRC Times Electric, Hitachi Energy, Toshiba, etc. In 2023, the global top four players had a share approximately 88.0% in terms of revenue.
About The Authors
| Junping Yang - Lead Author | |
| Email: yangjunping@qyresearch.com | |
| Junping Yang is a technology & market senior analyst specializing in semiconductor devices, materials, and equipment. Yang has 10 years’ experience in semiconductor and focuses semiconductor equipment/parts, materials (silicon wafer, photoresist, CMP, silicon electrodes and rings), ICs, discrete devices, sensors/MEMS, RF, package & testing, etc. Typical studies include ICs, power semiconductor (IGBT, SiC, diode, MOSFET, modules and discrete), compound semiconductor (SiC, GaN, etc.), RF, optoelectronics, ceramic substrates (HTCC, LTCC, DBC, AMB, DPC, DBA), equipment & parts (wafer transfer robot, EFEM/Sorter, heaters, chiller, etc.), Lithography Systems, semiconductor refurbished/used equipment and parts, semiconductor chamber cleaning/coating, semiconductor equipment parts (ceramics, metal, plastic), Lasers, Electronic Ceramics, etc. He is engaged in the development of technology and market reports and is also involved in custom projects. |
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