Metal diamond composite material, by adding diamond particles with high thermal conductivity and low expansion coefficient to Al with good thermal conductivity In Cu or Ag matrix, excellent composite properties with high thermal conductivity and adjustable thermal expansion coefficient are integrated, which is considered as the most promising new type of thermal management material. This high-performance metal matrix composite heat dissipation material is mainly used in high-tech devices such as high-power insulated gate bipolar transistors (IGBTs), microwave, electromagnetic, optoelectronic and other devices, as well as defense technology fields with typical applications such as phased array radar and high-energy solid-state lasers.
Copper diamond composite materials are a type of composite material with copper as the matrix and diamond particles as the reinforcement. This material has significant characteristics of high thermal conductivity and low expansion. The material can be formed into complex shaped products by near net forming or mechanical processing, and can adapt to surface metalization and welding processes. specially suitable as heat sink materials for electronic devices, related products have been widely applied in key fields such as high-power semiconductor lasers, radar TR modules, spacecraft thermal control modules, etc.
Aluminum diamond is a composite material composed of aluminum and diamond, which is an excellent material with low thermal expansion, high thermal conductivity, high strength, and lightweight. This product has received high attention as a heat dissipation component for GaN semiconductor chips.
According to the new market research report “Metal Diamond Composite Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”, published by QYResearch, the global Metal Diamond Composite Materials market size is projected to reach USD 0.6 billion by 2030, at a CAGR of 10.4% during the forecast period.
- Global Metal Diamond Composite Materials Market Size (US$ Million), 2019-2030
Source: QYResearch, "Metal Diamond Composite Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
- Global Metal Diamond Composite Materials Top 8Players Rankingand Market Share (Ranking is based on the revenue of 2023, continually updated)
Source: QYResearch, "Metal Diamond Composite Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
According to QYResearch Top Players Research Center, the global key manufacturers of Metal Diamond Composite Materials include Sumitomo Electric Industries (ALMT Corp), Denka, Changsha Saneway Electronic Materials, Tiger Technologies, Technisco, Xi’An TRUSUNG Advanced Material, TGS, Haitexinke New Material Technology, etc. In 2023, the global top five players had a share approximately 77.0% in terms of revenue.
- Metal Diamond Composite Materials, Global Market Size, Split by Product Segment
Source: QYResearch, "Metal Diamond Composite Materials- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
In terms of product type, Cu-Diamond is the largest segment, hold a share of 49.2%,
Market Drivers:
The improvement of material performance requirements in fields such as electronic packaging has led to a demand for diamond copper composite materials. Existing electronic packaging materials, such as W-Cu Composite materials such as Mo Cu, SiCp Al, SiCp Cu, and BeO-Cu are unable to meet the heat dissipation needs of future high-power devices. It exhibits locality in the application of high output modules. Diamond copper is a typical composite material that pursues higher thermal conductivity in the industry.
With the rapid development of powerful, compact and portable mobile electronic products, the size of electronic components is getting smaller and the integration degree of circuits is also getting higher. Correspondingly, higher requirements are put forward for the stability, reliability, and heat dissipation performance of electronic packaging materials. Therefore, in order to adapt to the development needs of semiconductor technology, electronic packaging materials must fully consider multiple parameter requirements such as thermal conductivity, thermal expansion coefficient, density, strength, and reasonable packaging process. Traditional resistance packaging materials often use alloy materials that are easy to process, but in most cases, alloys are difficult to meet comprehensive performance requirements. For example, Invar alloy and Kovar alloy have low thermal expansion coefficient but poor thermal conductivity; Metal materials such as copper and aluminum have good thermal conductivity.
About The Authors
Yunmei Sun---Lead Author
Email: sunyunmei@qyresearch.com
Sun Yunmei has 2 years of industry research experience, focusing on research in the chemical industry chain related fields, including medical grade reagents, high-purity reagents for semiconductors, and chemical laboratory equipment.
About QYResearch
QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 17 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.
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