Aluminum diamond is a composite material composed of aluminum and diamond, which is an excellent material with low thermal expansion, high thermal conductivity, high strength, and lightweight. This product has received high attention as a heat dissipation component for GaN semiconductor chips.
According to the new market research report “Aluminium Diamond- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”, published by QYResearch, the global Aluminium Diamond market size is projected to reach USD 0.17 billion by 2030, at a CAGR of 6.8% during the forecast period.
- Global Aluminium Diamond Market Size (US$ Million), 2019-2030
Source: QYResearch, "Aluminium Diamond- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
- Global Aluminium Diamond Top 5Players Rankingand Market Share (Ranking is based on the revenue of 2023, continually updated)
Source: QYResearch, "Aluminium Diamond- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
According to QYResearch Top Players Research Center, the global key manufacturers of Aluminium Diamond include Denka, Changsha Saneway Electronic Materials, etc. In 2023, the global top three players had a share approximately 73.0% in terms of revenue.
- Aluminium Diamond, Global Market Size, Split by Product Segment
Source: QYResearch, "Aluminium Diamond- Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”
In terms of product type, Thermal Conductivity 400w/(m·k) is the largest segment, hold a share of 65.7%,
Market Drivers:
With the rapid development of powerful, compact and portable mobile electronic products, the size of electronic components is getting smaller and the integration degree of circuits is also getting higher. Correspondingly, higher requirements are put forward for the stability, reliability, and heat dissipation performance of electronic packaging materials. Therefore, in order to adapt to the development needs of semiconductor technology, electronic packaging materials must fully consider multiple parameter requirements such as thermal conductivity, thermal expansion coefficient, density, strength, and reasonable packaging process. Traditional resistance packaging materials often use alloy materials that are easy to process, but in most cases, alloys are difficult to meet comprehensive performance requirements. For example, Invar alloy and Kovar alloy have low thermal expansion coefficient but poor thermal conductivity; Metal materials such as copper and aluminum have good thermal conductivity.
About The Authors
Yunmei Sun---Lead Author
Email: sunyunmei@qyresearch.com
Sun Yunmei has 2 years of industry research experience, focusing on research in the chemical industry chain related fields, including medical grade reagents, high-purity reagents for semiconductors, and chemical laboratory equipment.
About QYResearch
QYResearch founded in California, USA in 2007.It is a leading global market research and consulting company. With over 17 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.
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