According to the new market research report “Global Wafer Grinder (Wafer Thinning Equipment) Market Research Report 2024”, published by QYResearch, the global Wafer Grinder (Wafer Thinning Equipment) market size is projected to reach USD 1.32 billion by 2029, at a CAGR of 6.5% during the forecast period.
- Global Wafer Grinder (Wafer Thinning Equipment) MarketSize(US$ Million), 2018-2029
Source: QYResearch, “Global Wafer Grinder (Wafer Thinning Equipment) Market Research Report 2024”
- Global Wafer Grinder (Wafer Thinning Equipment) Top11Players Ranking and Market Share (Ranking is based on the revenue of 2022, continually updated)
Source: QYResearch, “Global Wafer Grinder (Wafer Thinning Equipment) Market Research Report 2024”
The global key manufacturers of Wafer Grinder (Wafer Thinning Equipment) include Disco, ACCRETECH, Okamoto Semiconductor Equipment Division, CETC, G&N, Koyo Machinery, WAIDA MFG, Hunan Yujing Machinery Co., Ltd., SpeedFam, Revasum, etc. In 2022, the global top five players had a share approximately 88.0% in terms of revenue.
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